I. Formulation Ratios of Epoxy Resin AB Glue

(1) Use a dry cotton cloth or sandpaper to remove dust, oil stains, rust, etc. from the bonding surface, and then wipe it with a cleaner such as acetone or trichloroethylene to clean the bonding surface.

(2) Unscrew the front cover. Mix Component A and Component B in the weight ratio specified above (A:B = 2:1) thoroughly before use. For optimal performance, it can also be used after degassing in a vacuum.

(3) Ensure that the mixed glue is used up within the workable time; otherwise, it will solidify, resulting in material waste. Full strength can be achieved after 24 hours.

(4) After applying the glue: Curing takes 2 - 6 hours at room temperature, and 1 - 3 hours at 104 - 122°F (40 - 50°C). The bonded items can be used 24 hours after gluing, and the bonding strength will be even better after ten days. In cold, damp weather, it is advisable to bond at a room temperature of 59 - 77°F (15 - 25°C).

(5) When bonding vertical or hanging surfaces, use adhesive tape to assist after applying the glue, or use super glue (such as 502 glue) for positioning. The epoxy resin AB glue is a two - component high - temperature - resistant adhesive based on epoxy resin, mainly suitable for bonding high - temperature - resistant metals, ceramics, etc. Its working temperature ranges from - 58°F to + 356°F (- 50°C to + 180°C), and it can withstand a short - term temperature of up to + 482°F (+ 250°C).

II. Usage Methods of Epoxy Resin AB Potting Glue
A: Manual Mixing and Application of AB Glue
Mix the AB glue in the required ratio. Weigh the resin and curing agent accurately, and mix them thoroughly in a container or on a workbench until a uniform mixture is formed. Then apply the mixed glue to the pre - treated, clean bonding surface. Plastic mixing blades or bamboo sticks can be used as mixing tools. This method is often used for AB glues with a long working time, as well as for trials or small - batch production. Control the amount of mixed glue each time, as the reaction between Components A and B generates heat. The more glue mixed, the shorter the curing time and working time, which may lead to waste.

B: Squeezing AB Glue with a Manual Special Glue Gun
For AB glues packaged in mixing tubes with different ratios, install them on a glue dispenser. Combine with a mixing nozzle to evenly mix Components A and B, and directly apply the mixed glue to the surface to be bonded by manual squeezing. This method is suitable for continuous gluing, effectively extending the working time and controlling the glue application amount. However, if gluing is stopped for a period, the mixing nozzle will clog and need to be replaced, and some glue will be wasted. It is mainly applicable to 50ml epoxy bonding glue packages, and currently available ratios include 1:1, 2:1, 4:1, and 10:1.

C: Dispensing AB Glue with a Handheld Pneumatic Dispenser
Install AB glues in mixing tube packages of different ratios into a customized two - component dispensing valve (or dispensing cylinder). Combine with a mixing nozzle to evenly mix Components A and B. Connect to an air source, and the mixed glue can be directly applied to the surface to be bonded by squeezing. The pneumatic dispenser can be set for timed and fixed-quantity dispensing, which is more operable than the manual glue gun. It is convenient and labor - saving for workers, and the equipment cost is low. It is mainly applicable to 50ml packages, with currently available ratios of 1:1, 2:1, 4:1, and 10:1.

D: Intelligent Automatic AB Glue Dispensing Machine
Compared with ordinary dispensing machines, the automatic AB glue dispensing machine also uses air pressure to push the glue out of the barrel, and the glue output is controlled by a valve. The difference lies in that it has two sets of control systems, respectively controlling Glue A and Glue B. It features intelligent operation, accurate dispensing, and high - speed performance, making it suitable for complex dispensing tasks. The dispensing amount and travel can be controlled through a program, ensuring high consistency. It is an excellent choice for applications requiring high precision, bonding of irregular materials, assembly - line operations, and increased production efficiency. It can be used for AB glues with different ratios.