1. Acrylate AB Glue

• Primary Material: Acrylate.
• Curing Condition: Cures at room temperature.
• Properties: High mechanical strength, good toughness.
• Applications: Widely used for various structural bonding, such as metal, rigid plastic, wood, stone, ceramic, and gemstone.
• Limitations: Poor adhesion to copper, aluminum, cadmium-plated materials, polypropylene (PP), and polytetrafluoroethylene (PTFE).
• Mix Ratio: Typically 1:1.
  

2. Silicone AB Glue

• Primary Material: Silicone rubber.
• Applications: Mainly used for sealing purposes, such as LED module filling, LED light encapsulation, and electronic component filling.
• Mix Ratio: Not fixed (e.g., 10:1, 8:1, etc.).
  

3. Epoxy AB Glue

• Primary Material: Epoxy resin.
• Curing Condition: Cures at room temperature with high mechanical strength.
• Properties: Less tough than acrylate but higher in hardness.
• Applications: Wide range of bonding materials for structural purposes.
• Challenges: Viscosity is significantly affected by temperature, leading to potential process control difficulties.
• Dual Use: Suitable for both bonding and sealing, especially for high-quality electronic component filling and encapsulation.
• Mix Ratio: Usually 1:1 for bonding; 2:1, 4:1, or 10:1 for potting and sealing applications.