Model Comparison: 5005AB vs 105AB
| Item | HS5005AB (Balanced Anti-Static Model) | HS105AB (High-insulation, high-toughness model) |
|---|
| Mix Ratio (by weight) | A:B = 4:1 | A:B = 5:1 |
| Core Feature | High insulation, high hardness | Flame retardant, good toughness, no cracking |
| Working Time (25℃) | 60-80 mins (50g) | ~30 mins (100g) |
| Full Cure Time | 16-24 hours @ room temperature | 24h @ RT / 2h @ 60℃ |
| Cured Hardness | Shore D > 80 | Shore D > 75 |
| Ideal Application | Low-voltage accessories, Micro-capacitor, anti-static products | Electronic components requiring flame retardant compliance, power modules |
Core Advantages
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Superior Electrical Insulation
Withstand voltage up to 22KV/mm, high volume resistivity up to 1×10¹⁵ Ω·cm, effectively prevents short circuit and leakage, protects electronic circuits. | ![]()
Flame Retardant Option
HS105AB formula meets flame retardant requirements, releases low smoke when burning, suitable for power supplies and high-safety electronic products. |
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All-Round Protection
After curing, forms a dense black sealing layer, waterproof, moisture-proof, dust-proof, shock-resistant, extends service life of electronic components. | ![]()
Stable Curing Performance
Low shrinkage after curing, no cracking, good toughness, strong adhesion to various substrates, consistent quality in mass production.
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Production Friendly
Standard 5:1 weight ratio, moderate viscosity, good fluidity, easy to penetrate into gaps, suitable for both manual and automatic potting processes. | ![]()
Environmental Compliance
Solvent-free formula, meets RoHS and REACH standards, complete export certification documents, supports global electronic industry supply chains. |
Full Technical Specifications
Physical Properties Before Curing
| Test Item | HS5005A / HS5005B (Balanced Anti-Static Model) | HS105A / HS105B (High-insulation, high-toughness model) |
|---|
| Appearance | Part A: Black liquid / Part B: Brown liquid | Part A: Black liquid / Part B: Transparent tan liquid |
| Viscosity (25℃, Part A) | 1300 - 1400 mPa·s | 1000 - 1200 mPa·s |
| Viscosity (25℃, Part B) | 50 - 100 mPa·s | 100 - 200 mPa·s |
| Mix Ratio by Weight | A:B = 4:1 | A:B = 5:1 |
| Working Time (25℃) | 60-80 mins (50g mix) | ~30 mins (100g mix) |
| Shelf Life (25℃, Sealed) | 6 months | 6 months |
| Resin Base | Oil-based, 100% solids, solvent-free | Oil-based, 100% solids, solvent-free |
Properties After Full Curing
| Test Item | HS5005AB (Balanced Anti-Static Model) | HS105AB (High-insulation, high-toughness model) |
|---|
| Hardness | Shore D > 80(High hardness) | Shore D > 75(Toughening) |
| Withstand Voltage | 22 KV/mm | 22 KV/mm |
| Volume Resistivity | 3 × 10¹³ Ω·cm | 1 × 10¹⁵ Ω·cm |
| Surface Resistivity | 1 × 10¹⁴ Ω/sq | 5 × 10¹⁵ Ω/sq |
| Bending Strength | 240 kg/cm² | 2300 kg/cm² |
| Flame Retardant Grade | UL94 V0 | UL94 V0 |
The highest rating in the UL94 flame retardancy system is 5VA (a high-power, five-cycle flame exposure test), commonly used in high-end, high-voltage new energy applications. Products in this series have passed the UL94 V-0 vertical burn test; they self-extinguish rapidly upon removal of the flame and do not produce flaming drips, fully meeting fire safety compliance requirements for electronics, signage, and standard power supply applications.
Application Scenarios
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Capacitor & Transformer Potting
Small low-voltage types: HS5005AB; High-power high-voltage types: HS105AB | ![]()
Power Module & Driver Potting
Exclusive for Model HS105AB FR (High voltage & anti-cracking demand) |
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PCB Board Encapsulation
Low-voltage consumer boards: HS5005AB; High-voltage industrial/vehicle boards: HS105AB | ![]()
Small Electronic Components
Exclusive for Model HS5005AB (Anti-static protection for micro chips) |
Widely applied for insulation potting of capacitors, transformers, power modules, sensors and circuit boards, shielding internal electronics against moisture, dust, vibration & corrosion.
Standard Potting Process
| 🟢 Keep the electronic components to be potted dry and clean, free of dust, oil and moisture. |
| 🟢 Stir Part A thoroughly before use to ensure uniform dispersion of fillers and pigments. |
| 🟢 Weigh Part A and Part B strictly according to the corresponding weight ratio, stir fully and evenly. |
| 🟢 Vacuum degassing is recommended for better bubble-free effect, then pour into components promptly. |
| 🟢 Glue will gradually penetrate into gaps, secondary potting is available if needed. |
| 🟢 Keep environment clean during curing, prevent dust from falling on uncured surface. |
| 🟢 Wait for full curing before subsequent assembly or packaging. |
Package & Factory Advantages
Standard Package
![]() 5kg / 20kg standard set (A+B matched per ratio)
![]() 200kg industrial drum for large volume orders
![]() Custom package size and formula available
![]() Sealed iron/plastic drum, leakage-proof for shipping
![]() Private label OEM service supported
![]() Complete export packaging for sea/air freight | Why Choose Our Factory
![]() 10+ years professional electronic adhesive manufacturer
![]() In-house R&D lab, support formula customization
![]() Strict QC for every batch, stable electrical performance
![]() Adequate raw material stock, fast delivery for bulk orders
![]() Full technical support for on-site process guidance
![]() Full export documents: MSDS, TDS, COA, RoHS |
Storage & Safety Notes
![]() Store tightly sealed at 25℃, relative humidity <70%, away from direct sunlight. | ![]() Part B is highly hygroscopic, seal the drum immediately after each use to avoid deterioration. |
![]() Mixed glue releases heat during curing; larger mixing volume leads to faster reaction. | ![]() Control single mixing amount to prevent rapid heat generation and shortened working time. |
![]() Use mixed glue within the specified working time for best performance. | ![]() Wear protective goggles and gloves; wash thoroughly with soap if skin contact occurs. |
Get Samples for Test
Store tightly sealed at 25℃, relative humidity <70%, away from direct sunlight.
